Publications

Our projects have an impact in many different industries. Browse our publications to find out more.

A power efficient crossbar arbitration in multi-NoC for multicast and broadcast traffic

Sonal Yadav, V. Laxmi, Hemangee K. Kapoor, Manoj Singh Gaur & Mark Zwolinski, 2019

DOI: 10.1109/iSES.2018.00060

Type: conference

HWCVD a-Si:H interlayer slope waveguide coupler for multilayer silicon photonics platform

Rafidah Petra, Swe Zin Oo, Antulio Tarazona, Robert Cernansky, Scott A. Reynolds, Ali Z. Khokhar, Vinita Mittal, David J. Thomson, Alberto Politi, Goran Z. Mashanovich, Graham T. Reed & Harold M.H. Chong, 2019, Optics Express, 27(11), 15735-15749

DOI: 10.1364/OE.27.015735

Type: article

POETS: Distributed event-based computing - scaling behaviour

Andrew Brown, Mark Vousden, Alexander Rast, Graeme McLachlan Bragg, David Thomas, Jonny Beaumont, Matthew Naylor & Andrey Mokhov, 2019

Type: conference

Electroluminescence enhancement in mid-infrared InAsSb resonant cavity light emitting diodes for CO₂ detection

Furat Al-Saymari, Adam Craig, Yasir Noori, Qi Lu, Andrew Marshall & Anthony Krier, 2019, Applied Physics Letters, 114(17), 171103

DOI: 10.1063/1.5090840

Type: article

Silicon-germanium composition tunability by application of Rapid Melt Growth (RMG) for the silicon-on-insulator platform

Katarzyna Grabska, Mehdi Banakar, Thalia Domínguez Bucio, Miloš Nedeljković, Andrea Barzaghi, Andrea Ballabio, Giovanni Isella, Callum Littlejohns, Shinichi Saito & Frederic Gardes, 2019

Type: conference

Vertically coupled a-Si:H multimode interference waveguides for multi-layer silicon photonics platform

Swe Oo, Antulio Tarazona, Ali Khokhar, Graham Reed, Anna Peacock & Harold Chong, 2019

DOI: 10.1364/CLEO_AT.2019.ATh3I.4

Type: conference

Hot wire chemical vapor deposition for silicon photonics: an emerging industrial application opportunity

Antulio Tarazona, Thalia Domínguez Bucio , Swe Oo, R. Petra, Ali Khokhar, Stuart Boden, Frederic Gardes, Graham Reed & Harold Chong, 2019, Thin Solid Films, 676, 26-30

DOI: 10.1016/j.tsf.2019.02.048

Type: article